A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
Teilenummer: A3P600-FG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $63.2 | $632,00 |
| 100 | $57.8 | $5.780,00 |
| 500 | $52.4 | $26.200,00 |
| 1.000 | $48.9 | $48.900,00 |
A3P600-FG256 Übersicht
A flash-based FPGA stores its configuration in on-chip flash cells rather than the SRAM lookup tables and external configuration ROM used by SRAM FPGAs such as Xilinx Spartan or Intel/Altera Cyclone families. Within the programmable logic hierarchy, the A3P600 is a mid-density member of the ProASIC3 family, sitting between the A3P400 and A3P1000, and belongs to the broader category of field programmable gate arrays and programmable system logic.
Key features include reprogrammable 130-nm 7-layer-metal flash-based CMOS process technology, Instant On Level 0 support (the device is functional within microseconds of power-up with no external boot device), single-chip solution architecture, and up to 144 kbits of True Dual-Port SRAM across the family. The flash fabric delivers secure, low-total-cost-of-ownership programmable logic with live-at-power-up behavior that SRAM FPGAs cannot match without external configuration memory.
Architecturally, the A3P600 uses a sea-of-gates fabric of VersaTiles, each configurable as combinational logic, D flip-flop, or latch, organized into four I/O banks with independently supplied VCCIBx rails supporting mixed-voltage I/O standards. Internal system performance reaches approximately 231 MHz.
Typical applications include industrial automation and motor control, aerospace and defense glue logic and control planes, secure embedded controllers, communications bridging, and test instrumentation, where instant-on operation, security, and supply-chain-friendly single-chip BOM are valued.
Design consideration: commercial temperature grade (0 to 70 C ambient, up to 85 C junction) - choose the A3P600-FG256I industrial variant or automotive flows for harsher environments, and verify I/O bank voltage assignment early, since VCCIBx banks constrain which I/O standards share a bank.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P600-FG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P600-FG256 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Operating Temperature, Process Technology, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P600-FG256I
✅ Drop-In✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →A3P600-FGG256
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →A3P600-FGG256I
✅ Drop-In✓ Auf Lager
$96.23 / Stück
Datenblatt ansehen →A3P600-1FGG256
✅ Drop-In✓ Auf Lager
$18.75 / Stück
Datenblatt ansehen →A3P600-2FGG256I
✅ Drop-In✓ Auf Lager
$49.8 / Stück
Datenblatt ansehen →A3P600L-FG256I
✅ Drop-In✓ Auf Lager
$53.6 / Stück
Datenblatt ansehen →A3P600-FG256 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 (Flash FPGAs) |
| System Gates | 600000 |
| Logic Elements | 7K LEs (VersaTiles) |
| Embedded SRAM | 110592 bits (True Dual-Port) |
| User I/O | 177 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | Approx. 231 MHz |
| Configuration Technology | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | Instant On Level 0 support |
| Gehäuse | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 C to 85 C (TJ) |
| I/O Banks | 4 (independent VCCIBx supplies) |
| Packaging | Tray |
| RoHS-Status | RoHS non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | 8 weeks |
A3P600-FG256 256-lbga / fbga (17x17 mm, 1 mm pitch) Pinbelegungsleitfaden
Pinbelegung für A3P600-FG256 (256-lbga / fbga (17x17 mm, 1 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P600-FG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P600-FG256 ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Aerospace and Defense Control Logic, Secure Embedded Controllers, Communications Bridging and Protocol Conversion, Test and Measurement Instrumentation, Portable and Low-Power Edge Systems.
Industrial Automation and Motor Control
The A3P600-FG256 fits industrial automation and motor control well because its 600,000 flash-based gates and 110592-bit True Dual-Port SRAM implement PWM engines, quadrature encoders, fieldbus bridging, and safety interlocks in a single live-at-power-up chip. Its four independently supplied I/O banks (individual VCCIBx rails) accept the 3.3V, 2.5V, and 1.8V logic families common on PLC backplanes without level-shifting glue. Because configuration is stored in on-chip 130-nm flash with Instant On Level 0 support, drives and controllers are ready within microseconds of power-up - critical for deterministic startup - and no external configuration flash needs to be secured. Trade-off: the flash fabric has finite program/erase cycles compared to SRAM FPGAs, so place the part in field-upgrade-rare roles rather than daily-reflashed prototypes.
Empfohlen
Aerospace and Defense Control Logic
ProASIC3 flash FPGAs are a proven choice for defense ground equipment, avionics support hardware, and New Space payloads where a single-chip, configuration-upset-resistant fabric is valued. The A3P600-FG256's on-chip flash removes the external bitstream store that SRAM FPGAs require, shrinking the single-event-upset and reverse-engineering attack surface; Microchip's complementary RTAX-S/SL antifuse families (e.g., RTAX2000S-CQ352V) serve full flight programs. With 177 user I/Os and approximately 231 MHz internal performance, the device hosts telemetry framing, bus interfaces, and payload sequencers. Design consideration: this commercial-grade part is rated 0 to 85 C junction, so specify the A3P600-FG256I/Fgg256I industrial variants or RTAX parts for wide-temperature and radiation environments, and follow Microchip's PCN0708 pinout revisions in board design.
Empfohlen
Secure Embedded Controllers
For secure embedded controllers that must protect firmware and design IP, the A3P600-FG256's non-volatile flash fabric means there is no bitstream on an external bus to intercept during boot - a structural security advantage over SRAM FPGAs. The 600K-gate fabric implements cryptographic wrappers, tamper-detection logic, and secure state machines, while 110592 bits of True Dual-Port SRAM buffers data between security domains. Instant On behavior ensures the protection logic is active before other board-level devices initialize. Per Microchip product literature, ProASIC3 targets low total cost of ownership single-chip solutions, which reduces BOM audit surface for certified products. Trade-off: reprogrammability is bounded by flash endurance, so plan firmware update strategy around Microchip's specified program/erase cycles rather than treating it like SRAM reconfigurability.
Empfohlen
Communications Bridging and Protocol Conversion
The A3P600-FG256 serves as a protocol bridge between legacy and modern interfaces in networking and industrial communications equipment. Its 177 user I/Os across four voltage banks let one device terminate 3.3V UART/SPI legacy ports and 1.8V/2.5V high-speed links simultaneously, and the 110592-bit True Dual-Port SRAM implements elastic buffers and FIFOs for clock-domain crossing. Flash-based Instant On support means the bridge is operational before host processors finish booting, preventing bus lockups at cold boot. At approximately 231 MHz internal performance, the fabric sustains typical 10/100 Ethernet MAC, CAN, and serial protocol cores. Consider that for multi-gigabit SerDes workloads a higher-tier family (A3PE or Fusion) is more appropriate; this part targets parallel and low-gigabit bridging.
Empfohlen
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A3P600-FG256's deterministic, instant-on control fabric: trigger engines, timing generators, and scanner sequencers run the moment power is applied, with no configuration-download latency. The 600K-gate fabric plus 110592 bits of dual-port SRAM handle stimulus playback and result capture, while 177 I/Os fan out to relay drivers, ADC front ends, and DUT interfaces across four mixed-voltage banks. Reprogrammable flash allows instrument firmware feature updates in the field without socketed parts, supporting long service lives. Design note: because flash programming is in-system via JTAG, reserve header access on production boards; the commercial 0-85 C junction rating is adequate for lab environments, but benchtop units with sealed enclosures should verify thermal derating of the 17x17 mm BGA.
Empfohlen
Portable and Low-Power Edge Systems
Battery-operated edge devices, handheld instruments, and IoT gateways use the A3P600 family - especially the low-power A3P600L variants - because the flash fabric draws no configuration-load current and supports low static-power standby, unlike SRAM FPGAs that burn power holding bitstreams. The single 1.5V core (1.425V-1.575V) simplifies the power tree, and Instant On behavior enables event-driven wake-up where logic must respond before a host MCU boots. With 177 I/Os and 600K gates in a compact 17x17 mm BGA, the part integrates sensor interfacing, display scanning, and wireless module control in one device. Design trade-off: flash-based reprogramming cycles are finite, so firmware update mechanisms for battery devices should use host-side flash plus occasional FPGA reprogramming rather than frequent FPGA reflashing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P600-FG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P600-FG256I | A3P600-FGG256 | A3P600-1FGG256 | A3P600L-FG256I |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 177 | 177 | 177 | 177 | 177 |
| Embedded SRAM (bits) | 110592 | 110592 | 110592 | 110592 | 110592 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard (low-power) |
| Temperature Grade | Commercial (0 C to 85 C TJ) | Industrial | Commercial | Commercial | Industrial |
Wichtigste Unterscheidungsmerkmale
- Single-chip flash configuration - no external boot device (vs. Xilinx Spartan-3 / Intel Cyclone (functional equivalents))
- Lead-free drop-in upgrade available (vs. A3P600-FGG256)
- Four independent I/O voltage banks (vs. A3P600L-FG256I)
- Speed-grade headroom within the same footprint (vs. A3P600-1FGG256)
Designhinweise
Plan the power tree around the 1.5V core (1.425V-1.575V) plus one independent VCCIBx rail per I/O bank - four banks total on the A3P600. Only I/Os with compatible voltage standards may share a bank, per Microchip's ProASIC3 migration application note, so assign bank voltages before pin-locking in Libero IDE. Decouple each bank's VCCIBx with bulk (10 uF) plus local 0.1 uF ceramics near the balls; core supply ripple directly affects timing, so use a regulator with adequate transient response for simultaneous-switching I/O events.
Observe Microchip PCN0708: pinouts on A3P600-FG256/FGG256 (and related packages) were revised to achieve improved pin compatibility and optimized performance across the ProASIC3 family. Boards designed from pre-PCN documentation may have wrong ball assignments. Always validate your footprint against the current datasheet pin assignments chapter and, ideally, against the official a3p600_fg256.bsd BSDL file, which encodes the complete verified pin map for boundary-scan testing.
The 17x17 mm, 1 mm-pitch 256-ball BGA is a standard low-cost assembly target: 0.5 mm trace/0.12 mm via-in-pad or dog-bone escape routing on 4-6 layers is sufficient since only perimeter balls carry most signals and power balls are distributed. Follow the datasheet land-pattern recommendation, define solder-mask-defined pads, and treat the commercial 0-85 C junction rating as a design limit: budget junction temperature with local ambient near the device, not enclosure ambient, when verifying timing derating.
Mixed-voltage I/O banks make bank assignment a signal-integrity decision: group fast single-ended buses and clock outputs away from sensitive analog-adjacent banks, and match trace lengths on source-synchronous interfaces. Because the flash fabric powers up live (Instant On Level 0), outputs may drive within microseconds of VCC ramp - add pull resistors or enable-inhibit on outputs that must stay inactive during board-level power sequencing of other devices.
Compliance-Informationen
Microchip USA lists A3P600-FG256 as RoHS non-compliant; the FGG256 suffix variants are the lead-free/RoHS-compliant drop-ins. AEC-Q100 qualification not indicated for this commercial-grade part.
