A3PE3000-1FG324I vs A3PE3000-FG324 Vergleich

Detaillierter Direktvergleich von A3PE3000-1FG324I von Microchip Technology und A3PE3000-FG324 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000-1FG324I A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip

A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip

A3PE3000-1FG324I ✓ Aktiv
Microchip Technology
A3PE3000-FG324 A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000-1FG324I A3PE3000-FG324
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $196,00 $112,30
Logic Cells 75264 —
System Gates 3000000 3,000,000
Family ProASIC3E ProASIC3E Flash Family
Series A3PE3000 —
Number of I/Os 221 —
Maximum Operating Frequency 272 MHz —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm 130 nm CMOS
Gehäuse / Bauform 324-FBGA —
Montagestil SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Quiescent Supply Current 25 mA —
Configuration Memory Flash (non-volatile, single-chip) —
Programming Type In-system reprogrammable —
Packaging Tray Tray
RoHS-Status [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead, per digichip listing)
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Logic Elements / CLBs — 75,264
Maximum System Frequency — 231 MHz
User I/Os — 221
Configuration Technology — Flash (non-volatile, single-chip)
In-System Programming — Yes (JTAG, IEEE 1532-compliant)
Security — 128-bit AES decryption via JTAG; FlashLock
Gehäuse — 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch
Montageart — Surface Mount
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Embedded Memory — [DATA_NEEDED: embedded SRAM bits]
PLLs — [DATA_NEEDED: number of PLLs]
I/O Standards Supported — [DATA_NEEDED: supported I/O standards]
Lead Free Status — Contains Lead (per digichip listing)
Device ESD/HBM Rating — [DATA_NEEDED: ESD rating]

Datenblätter & Ressourcen

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