A3PE3000-1FG324I vs A3PE3000-FG324 Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FG324I par Microchip Technology et A3PE3000-FG324 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ ActifMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FG324I | A3PE3000-FG324 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $196,00 | $112,30 |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3,000,000 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| Series | A3PE3000 | — |
| Number of I/Os | 221 | — |
| Maximum Operating Frequency | 272 MHz | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm CMOS |
| Boîtier / Format | 324-FBGA | — |
| Style de montage | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Quiescent Supply Current | 25 mA | — |
| Configuration Memory | Flash (non-volatile, single-chip) | — |
| Programming Type | In-system reprogrammable | — |
| Packaging | Tray | Tray |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead, per digichip listing) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements / CLBs | — | 75,264 |
| Maximum System Frequency | — | 231 MHz |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Boîtier | — | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Type de montage | — | Surface Mount |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |