A3PE3000-1FG324I vs A3PE3000-FG324 Comparación
Comparación detallada lado a lado de A3PE3000-1FG324I por Microchip Technology y A3PE3000-FG324 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ ActivoMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-1FG324I | A3PE3000-FG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $196,00 | $112,30 |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3,000,000 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| Series | A3PE3000 | — |
| Number of I/Os | 221 | — |
| Maximum Operating Frequency | 272 MHz | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm CMOS |
| Encapsulado / Carcasa | 324-FBGA | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Quiescent Supply Current | 25 mA | — |
| Configuration Memory | Flash (non-volatile, single-chip) | — |
| Programming Type | In-system reprogrammable | — |
| Packaging | Tray | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead, per digichip listing) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements / CLBs | — | 75,264 |
| Maximum System Frequency | — | 231 MHz |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Encapsulado | — | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |