A3PE3000-FG324 vs A3PE3000-1FG324I Vergleich
Detaillierter Direktvergleich von A3PE3000-FG324 von Microchip Technology und A3PE3000-1FG324I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ AktivMicrochip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-FG324 | A3PE3000-1FG324I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,30 | $196,00 |
| Family | ProASIC3E Flash Family | ProASIC3E |
| System Gates | 3,000,000 | 3000000 |
| Logic Elements / CLBs | 75,264 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/Os | 221 | — |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| In-System Programming | Yes (JTAG, IEEE 1532-compliant) | — |
| Security | 128-bit AES decryption via JTAG; FlashLock | — |
| Gehäuse | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch | — |
| Montageart | Surface Mount | — |
| Packaging | Tray | Tray |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM bits] | — |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| I/O Standards Supported | [DATA_NEEDED: supported I/O standards] | — |
| RoHS-Status | RoHS Non-Compliant (contains lead, per digichip listing) | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead (per digichip listing) | — |
| Device ESD/HBM Rating | [DATA_NEEDED: ESD rating] | — |
| Logic Cells | — | 75264 |
| Series | — | A3PE3000 |
| Number of I/Os | — | 221 |
| Maximum Operating Frequency | — | 272 MHz |
| Gehäuse / Bauform | — | 324-FBGA |
| Montagestil | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Quiescent Supply Current | — | 25 mA |
| Configuration Memory | — | Flash (non-volatile, single-chip) |
| Programming Type | — | In-system reprogrammable |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |