A3PE3000-FG324 vs A3PE3000-1FG324I Comparación

Comparación detallada lado a lado de A3PE3000-FG324 por Microchip Technology y A3PE3000-1FG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3PE3000-FG324 A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 ✓ Activo
Microchip Technology
A3PE3000-1FG324I A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip

A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip

A3PE3000-1FG324I ✓ Activo

Comparación de especificaciones

Parámetro A3PE3000-FG324 A3PE3000-1FG324I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $112,30 $196,00
Family ProASIC3E Flash Family ProASIC3E
System Gates 3,000,000 3000000
Logic Elements / CLBs 75,264 —
Maximum System Frequency 231 MHz —
Process Technology 130 nm CMOS 130 nm
Core Supply Voltage 1.5 V 1.5 V
User I/Os 221 —
Configuration Technology Flash (non-volatile, single-chip) —
In-System Programming Yes (JTAG, IEEE 1532-compliant) —
Security 128-bit AES decryption via JTAG; FlashLock —
Encapsulado 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch —
Tipo de montaje Surface Mount —
Packaging Tray Tray
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] —
Embedded Memory [DATA_NEEDED: embedded SRAM bits] —
PLLs [DATA_NEEDED: number of PLLs] —
I/O Standards Supported [DATA_NEEDED: supported I/O standards] —
Estado RoHS RoHS Non-Compliant (contains lead, per digichip listing) [DATA_NEEDED: RoHS status]
Lead Free Status Contains Lead (per digichip listing) —
Device ESD/HBM Rating [DATA_NEEDED: ESD rating] —
Logic Cells — 75264
Series — A3PE3000
Number of I/Os — 221
Maximum Operating Frequency — 272 MHz
Encapsulado / Carcasa — 324-FBGA
Estilo de montaje — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Quiescent Supply Current — 25 mA
Configuration Memory — Flash (non-volatile, single-chip)
Programming Type — In-system reprogrammable
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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