A3PE3000-FG896 vs A3PE3000L-FGG896I Vergleich
Detaillierter Direktvergleich von A3PE3000-FG896 von Microchip Technology und A3PE3000L-FGG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
A3PE3000-FG896 ✓ AktivMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-FG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $129,80 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Number of I/O | 620 | 620 |
| Embedded Memory | 516096 bit | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (non-volatile, reprogrammable) | — |
| Logic Element Count (per distributor listing) | [DATA_NEEDED: verified LE/KLE count] | — |
| Gehäuse | 896-BGA (FBGA) | — |
| Montagestil | SMD/SMT | — |
| Betriebstemperatur | 0 C to +70 C | Industrial grade (I suffix) |
| Packaging | Tray | Tray, standard quantity 27 |
| Speed Grade | Standard (-) | Standard (no speed suffix) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch | — |
| Global Networks | VersaNet low-skew high-fanout networks | — |
| RoHS-Status | Non-green package (FG prefix; FGG variants are RoHS green) | [DATA_NEEDED: RoHS status] |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Versorgungsspannung | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Gehäuse / Bauform | — | 896-BGA (FBGA, 1 mm pitch) |
| Montageart | — | Surface Mount (SMD/SMT) |