A3PE3000-FG896 vs A3PE3000L-FGG896I Comparación
Comparación detallada lado a lado de A3PE3000-FG896 por Microchip Technology y A3PE3000L-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
A3PE3000-FG896 ✓ ActivoMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $129,80 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Number of I/O | 620 | 620 |
| Embedded Memory | 516096 bit | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (non-volatile, reprogrammable) | — |
| Logic Element Count (per distributor listing) | [DATA_NEEDED: verified LE/KLE count] | — |
| Encapsulado | 896-BGA (FBGA) | — |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | 0 C to +70 C | Industrial grade (I suffix) |
| Packaging | Tray | Tray, standard quantity 27 |
| Speed Grade | Standard (-) | Standard (no speed suffix) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch | — |
| Global Networks | VersaNet low-skew high-fanout networks | — |
| Estado RoHS | Non-green package (FG prefix; FGG variants are RoHS green) | [DATA_NEEDED: RoHS status] |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Tensión de alimentación | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Encapsulado / Carcasa | — | 896-BGA (FBGA, 1 mm pitch) |
| Tipo de montaje | — | Surface Mount (SMD/SMT) |