A3PE3000-FG896 vs A3PE3000L-FGG896I Comparaison
Comparaison détaillée côte à côte de A3PE3000-FG896 par Microchip Technology et A3PE3000L-FGG896I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
A3PE3000-FG896 ✓ ActifMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-FG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $129,80 | $139,90 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Number of I/O | 620 | 620 |
| Embedded Memory | 516096 bit | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (non-volatile, reprogrammable) | — |
| Logic Element Count (per distributor listing) | [DATA_NEEDED: verified LE/KLE count] | — |
| Boîtier | 896-BGA (FBGA) | — |
| Style de montage | SMD/SMT | — |
| Température de fonctionnement | 0 C to +70 C | Industrial grade (I suffix) |
| Packaging | Tray | Tray, standard quantity 27 |
| Speed Grade | Standard (-) | Standard (no speed suffix) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch | — |
| Global Networks | VersaNet low-skew high-fanout networks | — |
| Statut RoHS | Non-green package (FG prefix; FGG variants are RoHS green) | [DATA_NEEDED: RoHS status] |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Tension d'alimentation | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Boîtier / Format | — | 896-BGA (FBGA, 1 mm pitch) |
| Type de montage | — | Surface Mount (SMD/SMT) |