A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
Teilenummer: A3PE3000L-1FG324I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $172.5 | $1.725,00 |
| 100 | $158 | $15.800,00 |
| 500 | $146 | $73.000,00 |
| 1.000 | $135 | $135.000,00 |
A3PE3000L-1FG324I Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: logic cell / look-up table (LUT) -> fabric -> FPGA -> programmable SoC. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in non-volatile on-chip flash, delivering a true single-chip solution with instant-on operation and no external configuration PROM.
Key features include Flash*Freeze technology, which cuts static power dramatically by entering an ultra-low-power sleep mode while retaining state; core and I/O operation from 1.2V to 1.5V for dynamic power optimization; and 35K logic elements (LEs) equivalent density per the ProASIC3 low-power line. Compared with the standard ProASIC3 family, ProASIC3L devices reduce dynamic power by up to 40% and static power by up to 50%, according to the Microchip ProASIC3L datasheet (DS50003268).
The device is fabricated on a 130nm CMOS flash process and supports 892.86MHz-class internal performance for the family. Reprogrammability, abundant embedded memory, and single-chip operation lower total cost of ownership (TOC) versus antifuse or SRAM alternatives.
Typical applications include portable and battery-powered instrumentation, industrial automation control, medical monitoring equipment, communications line cards, and aerospace/defense systems requiring secure, non-volatile, low-power programmable logic.
Design considerations: the 'I' suffix denotes the industrial temperature range, and the '-1' suffix denotes the speed grade; both must match system requirements. Power budgeting should exploit Flash*Freeze entry/exit timing in the datasheet.
This page adds value beyond the datasheet by synthesizing distributor stock signals, drop-in speed-grade and packaging alternatives from the XAIPART catalog, and practical design notes in one AI-citable reference.
Drop-in-Alternativen für A3PE3000L-1FG324I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000L-1FG324I (gleiche Bauform und Footprint) – abweichend in Package, Family, Operating Temperature, System Gates, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000L-1FGG324I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG324I
✅ Drop-In✓ Auf Lager
$62.65 / Stück
Datenblatt ansehen →A3PE3000L-FG324I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG324
✅ Drop-In✓ Auf Lager
$86.15 / Stück
Datenblatt ansehen →A3PE3000L-1FG324
✅ Drop-In✓ Auf Lager
$135.9 / Stück
Datenblatt ansehen →A3PE3000-2FG324
✅ Drop-In✓ Auf Lager
$59 / Stück
Datenblatt ansehen →A3PE3000-FGG324I
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$198 / Stück
Datenblatt ansehen →A3PE3000L-1FG324I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | 221 |
| Total RAM Bits | 516096 |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage | 1.2 V to 1.5 V (family range) |
| Speed Grade | -1 |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | Flash*Freeze technology |
| Betriebstemperatur | -40C to +100C (industrial, I suffix) |
| Gehäuse | 324-ball FBGA (FG324) |
| Montageart | Surface Mount |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 |
| Static Power Reduction | Up to 50% vs ProASIC3 |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) |
A3PE3000L-1FG324I 324-ball fbga (fg324) Pinbelegungsleitfaden
Pinbelegung für A3PE3000L-1FG324I (324-ball fbga (fg324)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000L-1FG324I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000L-1FG324I ist geeignet für 6 Anwendungs: Portable Battery-Powered Instrumentation, Industrial Automation Control, Medical Monitoring Equipment, Communications Line Cards, Aerospace and Defense Systems, Smart IoT Edge and Sensor Aggregation.
Portable Battery-Powered Instrumentation
The A3PE3000L-1FG324I fits portable instrumentation because its 1.2V core operation and Flash*Freeze mode directly attack the two dominant battery drains: dynamic switching power and static leakage. According to the ProASIC3L datasheet, the L silicon cuts dynamic power by up to 40% and static power by up to 50% versus standard ProASIC3, and Flash*Freeze retains register and RAM state in an ultra-low-power sleep state so the instrument resumes instantly without reconfiguration. In a handheld data logger, the FPGA runs acquisition logic at 1.2V, then enters Flash*Freeze between measurement windows, stretching battery life substantially. The 324-ball FBGA at roughly 1.0mm pitch suits compact handheld PCBs, while the 221 user I/Os interface ADCs, displays, and sensors without external glue logic.
Empfohlen
Industrial Automation Control
Factory automation controllers benefit from the A3PE3000L-1FG324I's industrial -40C to +100C rating, non-volatile flash configuration, and deterministic instant-on behavior. Unlike SRAM FPGAs that need a boot device and milliseconds of configuration time, the ProASIC3L fabric is active as soon as power is applied - critical for machine safety interlocks and I/O modules that must be operational at power-up. With 3 million gates and 516096 RAM bits, the device integrates motor sequencing logic, encoder decoding, and fieldbus interfaces such as CAN or RS-485 in glueless form. The 221 user I/Os support 1.2V to 1.5V banks matching modern sensor levels, and flash-based configuration resists corruption in electrically noisy cabinets, lowering field-service costs in PLC and remote I/O designs.
Empfohlen
Medical Monitoring Equipment
Patient monitors and portable diagnostic devices demand low noise, low heat, and high reliability - all strengths of the A3PE3000L-1FG324I. Its 1.2V to 1.5V core operation minimizes junction power dissipation, keeping the 324-ball FBGA cool inside enclosed bedside housings with passive cooling only. Flash*Freeze mode lets the monitor drop front-end acquisition logic into a state-retaining sleep between sampling events, extending uptime during ambulatory monitoring sessions. The non-volatile single-chip architecture removes external configuration memory, reducing BOM count and eliminating a failure point in devices subject to regulatory scrutiny. With 35K logic-element-class density, the FPGA handles ECG/SpO2 digital filtering, display refresh, and communication interfaces simultaneously, while the industrial temperature rating provides margin against hospital equipment bays that exceed commercial limits.
Empfohlen
Communications Line Cards
Access-network and transport line cards use the A3PE3000L-1FG324I for framing, scrambling, and backplane glue logic where low static power matters across hundreds of deployed cards. The ProASIC3L's up to 50% static power reduction versus standard ProASIC3 compounds into significant opex savings in equipment drawing power continuously. The -1 speed grade supports the family's internal performance class for 892.86MHz-rated fabric paths in the 130nm ProASIC3EL generation, sufficient for parallel framing at line rates handled by companion PHYs. The 221 I/Os, bankable at 1.2V to 1.5V, bridgeprocessors, PHYs, and connectors. Non-volatile configuration enables cards to enumerate immediately on hot-swap insertion, and the industrial rating accommodates outside-plant cabinets and uncooled central-office shelves alike, with 516096 RAM bits available for elasticity buffers.
Empfohlen
Aerospace and Defense Systems
Defense electronics values the A3PE3000L-1FG324I for its flash-based, single-chip, secure configuration architecture - there is no external bitstream to intercept on an SRAM configuration bus, a recognized supply-chain and security advantage of the Actel/Microsemi/Microchip ProASIC3 lineage. The industrial -40C to +100C rating covers ruggedized ground and avionic-shelf environments, and the low static power suits conduction-cooled enclosures with limited thermal budget. Three million gates integrate telemetry encoding, bus bridging (MIL-STD-1553 companions, CAN, UART meshes), and sensor aggregation in one 324-ball device, while 516096 bits of block RAM buffer mission data. Flash*Freeze allows duty-cycled sensors to idle at minimal power between events. Microchip supports RTL integration in Libero SoC, and the family is a proven migration point from discontinued antifuse designs.
Empfohlen
Smart IoT Edge and Sensor Aggregation
IoT edge nodes aggregating many sensors onto one uplink exploit the A3PE3000L-1FG324I's combination of instant-on fabric, Flash*Freeze duty cycling, and 221 GPIOs. The flash-based FPGA boots in microseconds, captures sensor events immediately at power application, then either processes locally - 35K logic elements handle filtering, thresholding, and protocol conversion - or streams to a host microcontroller. Because configuration is non-volatile, no microcontroller boot-time gating is needed, simplifying power-sequencing design in energy-harvesting nodes. At a 1.2V core the device sips power while idle banks clock-gate, and Flash*Freeze suspends the whole fabric at minimal static draw between wake events. The 324-ball FBGA footprint gives enough I/O to fan-in dozens of I2C, SPI, and discrete sensor lines into a single aggregation point for gateways and industrial retrofit kits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000L-1FG324I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000L-1FGG324I | A3PE3000L-FG324I | A3PE3000L-1FG324 | A3PE3000-2FG324 | A3PE3000-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FG324) | 324-ball FBGA (FGG324) - same footprint | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FGG324) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power, Flash*Freeze) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (standard power) | ProASIC3E (standard power) |
| System Gates | 3M | 3M | 3M | 3M | 3M | 3M |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (slower than -1) | -1 | -2 (faster) | standard |
| Operating Temperature | -40C to +100C (I) | -40C to +100C (I) | -40C to +100C (I) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (I) |
| Flash*Freeze Low Power | Yes (up to 40%/50% dynamic/static reduction) | Yes | Yes | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Flash*Freeze ultra-low-power mode (vs. A3PE3000-2FG324)
- Industrial temperature with fastest -1 grade (vs. A3PE3000L-FG324I)
- Lead-free fine-pitch ball option available (vs. A3PE3000L-1FGG324I)
- Non-volatile single-chip secure configuration (vs. A3PE3000-FGG324I)
Designhinweise
Budget power using Microchip's ProASIC3L power calculator in Libero SoC rather than static datasheet numbers, since dynamic power scales with toggle rates. Exploit Flash*Freeze aggressively: the FLASH_FREEZE pin latches I/O state and gates the fabric, and the datasheet DS50003268 defines entry/exit timing that must be respected by the host controller. Core and I/O rails both accept 1.2V to 1.5V - running banks at the lowest voltage your interfaces tolerate yields the largest dynamic savings in battery designs.
The FG324 FBGA uses approximately 1.0mm ball pitch; plan fanout early, favoring via-in-pad or dog-bone escape on outer two ball rows. Provide solid power/ground ball rings per the Microchip packaging and pinout document and decouple each VCC/VCCA domain with an array of 0.1uF ceramics plus bulk capacitance near the bank supplies. Because this is a non-volatile device, no configuration PROM routing is needed, freeing board area - but still reserve programming-access routing for JTAG boundary scan and Libero-based device programming.
Do not substitute commercial-temperature parts (A3PE3000L-1FG324) into industrial designs - the 'I' suffix exists for the -40C to +100C range and qualification documents will fail audit. Do not assume non-L ProASIC3E parts (A3PE3000-2FG324) are power-equivalent despite the identical footprint; they lack Flash*Freeze and consume up to 50% more static power. Finally, timing closure at the standard speed grade may not meet -1 constraints - rerun static timing in Libero after any speed-grade substitution.
Compliance-Informationen
Compliance status for the exact I-suffixed MPN was not stated in the provided verified data; consult the Microchip product page A3PE3000L for current RoHS/REACH declarations. Note the FGG variants are Microchip's lead-free fine-pitch package line.
