A3PE3000L-1FGG324 vs A3PE3000L-1FG324I Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FGG324 von Microchip Technology und A3PE3000L-1FG324I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG324 ✓ AktivMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FGG324 | A3PE3000L-1FG324I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,95 | $135,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 | 3000000 |
| Logic Elements | 35K LEs | 35K LEs (75264 D-flip-flops equivalent family density) |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS flash |
| Technology | Nonvolatile Flash (Instant On) | — |
| Gehäuse | 324-ball FBGA (FGG324) | 324-ball FBGA (FG324) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -1 | -1 |
| Special Features | Flash*Freeze low-power technology | — |
| Reprogrammability | Yes (in-system reprogrammable flash) | — |
| Configuration | Single-chip, no external configuration device required | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | -40C to +100C (industrial, I suffix) |
| Max Fabric Frequency | [DATA_NEEDED: Maximum Fabric Frequency] | — |
| Total RAM Bits | — | 516096 |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Configuration Memory | — | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | — | Flash*Freeze technology |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |