A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
Teilenummer: A3PE3000L-1FGG324 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $63.1 | $631,00 |
| 100 | $57.8 | $5.780,00 |
| 500 | $52.4 | $26.200,00 |
| 1.000 | $47.95 | $47.950,00 |
A3PE3000L-1FGG324 Übersicht
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a configurable fabric of logic elements, routing resources, and I/O cells. The ProASIC3L family belongs to the nonvolatile flash FPGA class within the broader power-management and programmable-logic hierarchy: flash FPGA -> FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM-based FPGAs, its flash cells are nonvolatile, so the device powers up instantly without an external configuration PROM.
Key features include the ProASIC3L low-power fabric with Flash*Freeze technology for dramatic dynamic power reduction, a 1.2 V to 1.5 V core voltage range, single-chip secure operation, and reprogrammability without boot-time configuration delay. The device targets total-cost-of-ownership-sensitive designs by removing the need for configuration flash and external power-cycling circuitry.
Architecturally, the A3PE3000L uses a 130 nm CMOS flash process with 75264 logic cells organized in VersaTile clusters, allowing each tile to act as a logic function, registered logic, or small memory. The fabric supports high performance while the L-variant leverages low-power process and core operation for portable and power-constrained systems.
Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military and aerospace subsystems, and communications line-card glue logic, where nonvolatile instant-on configuration and low standby power are essential.
Design consideration: the 324-ball FBGA requires careful PCB layout with appropriate via-in-pad or dog-bone fanout, and core voltage selection (1.2 V vs 1.5 V) must match speed-grade requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000L-1FGG324 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000L-1FGG324 (gleiche Bauform und Footprint) – abweichend in Family, Package, Operating Temperature, Configuration Memory, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000L-1FGG324I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG324
✅ Drop-In✓ Auf Lager
$86.15 / Stück
Datenblatt ansehen →A3PE3000L-FGG324I
✅ Drop-In✓ Auf Lager
$62.65 / Stück
Datenblatt ansehen →A3PE3000L-1FG324I
✅ Drop-In✓ Auf Lager
$135 / Stück
Datenblatt ansehen →A3PE3000-2FGG324
✅ Drop-In✓ Auf Lager
$216 / Stück
Datenblatt ansehen →A3PE3000-FGG324I
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →A3PE3000L-1FGG324 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Technology | Nonvolatile Flash (Instant On) |
| Gehäuse | 324-ball FBGA (FGG324) |
| Montageart | Surface Mount |
| Speed Grade | -1 |
| Special Features | Flash*Freeze low-power technology |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Configuration | Single-chip, no external configuration device required |
| Lead Free Status | Lead Free |
| RoHS-Status | RoHS Compliant |
A3PE3000L-1FGG324 324-ball fbga (fgg324) Pinbelegungsleitfaden
Pinbelegung für A3PE3000L-1FGG324 (324-ball fbga (fgg324)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000L-1FGG324.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000L-1FGG324 ist geeignet für 6 Anwendungs: Industrial Automation Control, Portable and Battery-Powered Instruments, Secure Military and Aerospace Subsystems, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Instrumentation.
Industrial Automation Control
In PLC I/O modules, motor-control interfaces, and factory-floor sensing nodes, the A3PE3000L-1FGG324 provides 3 million gates of glue logic, interface bridging, and sequencing with 221 user I/Os to absorb multiple legacy ASSP functions. Its nonvolatile flash fabric is Instant On, so a line restart after power loss requires no configuration download - critical for equipment uptime. With a 1.2 V core and Flash*Freeze technology, idle cabinets cut dynamic power dramatically between production cycles. Placed between backplane connectors and local controllers, the FPGA terminates parallel buses and translates to modern serial links; the trade-off versus a microcontroller is higher flexibility at the cost of RTL design effort.
Empfohlen
Portable and Battery-Powered Instruments
Handheld test instruments, data loggers, and field meters benefit from the A3PE3000L-1FGG324's low-power ProASIC3L fabric: the 1.2 V core minimizes static consumption, and Flash*Freeze mode retains register and SRAM state while the device sleeps, enabling near-instant wake-up between measurement bursts. The 221 user I/Os drive LCD segments, keypads, and sensor interfaces without an external CPLD. Because the flash configuration is on-chip, no boot current is spent loading a bitstream, extending battery budget compared with SRAM FPGAs. Designers should budget I/O banking so active interfaces share banks powered during Flash*Freeze-adjacent operation, and verify wake-up timing against the Microchip datasheet AC tables.
Empfohlen
Secure Military and Aerospace Subsystems
ProASIC3L flash FPGAs are widely deployed in defense electronics because the single-chip, nonvolatile configuration eliminates the bitstream theft risk of external configuration PROMs, and the 130 nm flash process supports Microchip's security features for design protection. The A3PE3000L-1FGG324's 3M gates implement protocol engines, bus interfaces (MIL-STD-style parallel buses, UART/SPI bridges), and system controllers in one device, while the industrial-temperature A3PE3000L-1FGG324I variant covers extended environments. Instant-On behavior suits turret controllers and avionics LRUs that must be ready at power application. Designers should use Libero SoC security tooling and follow Microchip's defense application notes for reliable design flow.
Empfohlen
Communications Line Cards and Networking
In telecom and enterprise-network line cards, the A3PE3000L-1FGG324 handles backplane glue logic, LED/PHY supervision, hot-swap sequencing, and low-speed protocol conversion. The 3M-gate fabric absorbs CAM-control interfaces, I2C/SPI masters, and board-management state machines, while 221 I/Os connect to connectors, transceivers, and status planes. Flash*Freeze lets standby line cards drop dynamic power while retaining link state, easing chassis thermal budgets; the 1.2 V core reduces switching losses versus 1.5 V operation. Because the fabric is nonvolatile, a rebooted card resumes operation instantly without a configuration controller. Timing closure at speed grade -1 is straightforward for these sub-100 MHz state-machine workloads.
Empfohlen
Medical and Diagnostic Equipment
Portable diagnostics, patient monitors, and bench-top analyzers use the A3PE3000L-1FGG324 to interface sensor front ends, drive displays, and sequence measurement engines. The low-power fabric supports battery and cart-based operation, while the single-chip flash configuration avoids external memory that would otherwise add a failure point in regulated medical devices. Flash*Freeze keeps patient data latched between sampling windows, and Instant-On start-up shortens the time from power switch to ready screen - a user-experience and emergency-response benefit. The 3M-gate capacity implements DSP-lite preprocessing (filters, thresholds) ahead of the host processor. Verify I/O ESD and isolation requirements against IEC-60601 system-level goals during design.
Empfohlen
Test and Measurement Instrumentation
Bench instruments, automated test equipment (ATE), and protocol analyzers rely on the A3PE3000L-1FGG324 for timing generators, trigger matrices, and bus emulation across its 221 I/Os. The 3M-gate VersaTile fabric implements deep counters, pattern generators, and per-channel delay lines with deterministic, Instant-On startup - useful for calibration routines that run before an OS boots. Flash*Freeze maintains instrument state during idle periods on portable analyzers, and the 1.2 V core keeps shelf-mode current low. Compared with an MCU + CPLD stack, the single FPGA reduces BOM spread and yields deterministic timing skew. Route high-fanout clocks with balanced trees and verify setup/hold with Libero timing reports.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000L-1FGG324 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000L-1FGG324I | A3PE3000L-FGG324 | A3PE3000L-1FG324I | A3PE3000-2FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324) | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FG324) - same footprint, lead-finish variant | 324-ball FBGA (FGG324) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (performance) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (faster) | -1 | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
Wichtigste Unterscheidungsmerkmale
- Flash*Freeze ultra-low-power mode with state retention (vs. A3PE3000-2FGG324)
- Lowest dynamic power via -1 speed grade at 1.2 V core (vs. A3PE3000L-FGG324)
- Extended-temperature availability in identical footprint (vs. A3PE3000L-1FGG324I)
Designhinweise
The 324-ball FBGA (1.0 mm ball pitch class) demands a disciplined fanout strategy: use via-in-pad for power/ground balls or dog-bone escapes on perimeter signal balls, and define a 4+ layer stackup with dedicated core/GND planes. Escape routing density limits outer two rows to conventional traces; inner rows must escape through vias. Follow the Microchip ProASIC3L datasheet (DS50003268) package section and Microchip FPGA PCB layout application notes for ball map, keepouts, and land-pattern dimensions before finalizing the footprint.
Power the A3PE3000L core at 1.2 V for lowest dynamic power or up to 1.5 V for higher performance; the -1 speed grade typically permits 1.2 V core operation, but confirm the DC characteristics table in the datasheet for your grade. Provide separate regulated rails for core, I/O banks (VCCI), and the programming/Flash*Freeze supplies (VPT), with 10 uF bulk plus 0.1 uF high-frequency decoupling per bank. Sequencing requirements for multi-rail flash FPGAs are relaxed versus SRAM FPGAs, but verify the datasheet power-up specification to avoid configuration errors.
Do not confuse the FG vs FGG suffix: FGG324 uses a lead-free ball finish required for RoHS lines, while FG324 shares the same footprint but different ball metallurgy - verify solder-profile compatibility with your lead-free reflow profile. Also, instantiating Flash*Freeze requires the FLASH_FREEZE pin to be connected and the feature enabled in Libero SoC; leaving it unconnected forfeits the flagship low-power benefit. Finally, designs written for ProASIC3E (A3PE3000) must be re-verified before targeting the L variant.
Compliance-Informationen
RoHS compliant and lead free per distributor listings (DigChip, Mouser, DigiKey). REACH, halogen-free, and conflict-minerals status not stated in provided data - request manufacturer declarations.
