A3PE3000L-1FGG484I vs A3PE3000L-1FGG484M Vergleich

Detaillierter Direktvergleich von A3PE3000L-1FGG484I von Microchip Technology und A3PE3000L-1FGG484M von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-1FGG484I A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FGG484I ✓ Aktiv
Microchip Technology
A3PE3000L-1FGG484M A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip

A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip

A3PE3000L-1FGG484M ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-1FGG484I A3PE3000L-1FGG484M
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $104,50 $117,60
Family ProASIC3L ProASIC3L (Flash FPGAs with Flash*Freeze)
Number of Gates 3000000 —
Total RAM Bits 516096 —
Number of I/O 341 —
Versorgungsspannung 1.14 V to 1.575 V —
Core Voltage (Nominal) 1.2 V —
Core Voltage Range (per datasheet) 1.2 V to 1.5 V —
Speed Grade -1 -1
Gehäuse / Bauform 484-BGA —
Supplier Device Package 484-FPBGA (23x23) —
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +100C (TJ) [DATA_NEEDED: operating temperature range for -M suffix]
Technology 130 nm Flash —
Programmable Type In System Programmable (flash-based, non-volatile) —
Packaging Tray —
RoHS-Status ROHS3 Compliant [DATA_NEEDED: RoHS status]
Manufacturer Lead Time 8 weeks —
Product Status Active —
System Gates — 3000000
Logic Elements — 35K LEs
CLBs — 75264
User I/Os — 341
Embedded SRAM — 516096 bits (504 kbits) true dual-port
Core Voltage — 1.2 V to 1.5 V
I/O Voltage (VCCI) — as low as 1.2 V
Process Technology — 130 nm, 7-layer metal (6 copper) flash-based CMOS
Configuration — Non-volatile Flash, live-at-power-up, single-chip, reprogrammable
Special Features — Flash*Freeze technology
Gehäuse — 484-ball FBGA (FGG484), 1 mm pitch
Design Software — Microchip Libero SoC

Datenblätter & Ressourcen

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