A3PE3000L-1FGG484I vs A3PE3000L-1FGG484M Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FGG484I par Microchip Technology et A3PE3000L-1FGG484M par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ ActifMicrochip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FGG484I | A3PE3000L-1FGG484M |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $104,50 | $117,60 |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Tension d'alimentation | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Boîtier / Format | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (TJ) | [DATA_NEEDED: operating temperature range for -M suffix] |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| Statut RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3000000 |
| Logic Elements | — | 35K LEs |
| CLBs | — | 75264 |
| User I/Os | — | 341 |
| Embedded SRAM | — | 516096 bits (504 kbits) true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage (VCCI) | — | as low as 1.2 V |
| Process Technology | — | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | — | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | — | Flash*Freeze technology |
| Boîtier | — | 484-ball FBGA (FGG484), 1 mm pitch |
| Design Software | — | Microchip Libero SoC |