A3PE3000L-1FGG484I vs A3PE3000L-1FGG484M Comparación
Comparación detallada lado a lado de A3PE3000L-1FGG484I por Microchip Technology y A3PE3000L-1FGG484M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ ActivoMicrochip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FGG484I | A3PE3000L-1FGG484M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $104,50 | $117,60 |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Tensión de alimentación | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Encapsulado / Carcasa | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (TJ) | [DATA_NEEDED: operating temperature range for -M suffix] |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| Estado RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3000000 |
| Logic Elements | — | 35K LEs |
| CLBs | — | 75264 |
| User I/Os | — | 341 |
| Embedded SRAM | — | 516096 bits (504 kbits) true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage (VCCI) | — | as low as 1.2 V |
| Process Technology | — | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | — | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | — | Flash*Freeze technology |
| Encapsulado | — | 484-ball FBGA (FGG484), 1 mm pitch |
| Design Software | — | Microchip Libero SoC |