A3PE3000L-FG484 vs A3PE3000L-FG484I Vergleich
Detaillierter Direktvergleich von A3PE3000L-FG484 von Microchip Technology und A3PE3000L-FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AktivMicrochip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-FG484 | A3PE3000L-FG484I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Low Power Feature | Flash*Freeze technology | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | -40C to +100C (TJ, industrial) |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | ROHS3 Compliant |
| Logic Cells (DFFs) | — | 75264 |
| User I/O (this package) | — | 341 |
| Max User I/O (family) | — | 616 |
| Embedded SRAM | — | 504 kbit true dual-port |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | — | 1.14 V to 1.575 V (1.2 V typical) |
| Single-Chip Solution | — | Yes (no external configuration PROM) |
| Gehäuse | — | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Speed | — | [DATA_NEEDED: speed grade / max frequency] |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Logic Family | — | CMOS |