A3PE3000L-FG484 vs A3PE3000L-FG484I Comparison

Detailed side-by-side comparison of A3PE3000L-FG484 by Microchip Technology and A3PE3000L-FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-FG484 A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 ✓ Active
Microchip Technology
A3PE3000L-FG484I A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip

A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip

A3PE3000L-FG484I ✓ Active

Specification Comparison

Parameter A3PE3000L-FG484 A3PE3000L-FG484I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $112.00 $0.00
Family ProASIC3L (Low Power Flash FPGA) ProASIC3L (ProASIC3 Low Power)
System Gates 3000000 3000000 (3.00E6)
Logic Cells / CLBs 75264 —
User I/Os 341 —
Maximum System Frequency 250 MHz —
Core Voltage Range 1.2 V to 1.5 V —
Technology 130 nm CMOS flash, nonvolatile —
Configuration Flash-based, Instant On, single-chip Nonvolatile flash, Live-at-Power-Up Level 0
Low Power Feature Flash*Freeze technology —
Package Type 484-ball FBGA (PBGA484) —
Package Dimensions 23 x 23 mm, 1 mm ball pitch —
Package Height 2.23 mm —
Mounting Type Surface Mount Surface Mount
Process CMOS —
Operating Temperature [DATA_NEEDED: Operating Temperature] -40C to +100C (TJ, industrial)
Supply Voltage I/O [DATA_NEEDED: I/O supply voltage range] —
Embedded Memory [DATA_NEEDED: Embedded RAM block capacity] —
RoHS Status [DATA_NEEDED: RoHS compliance] ROHS3 Compliant
Logic Cells (DFFs) — 75264
User I/O (this package) — 341
Max User I/O (family) — 616
Embedded SRAM — 504 kbit true dual-port
Process Technology — 130 nm, 7-layer metal (6 copper), flash-based CMOS
Core Supply Voltage — 1.14 V to 1.575 V (1.2 V typical)
Single-Chip Solution — Yes (no external configuration PROM)
Package — 484-ball FBGA (23x23 mm, 1 mm pitch)
Speed — [DATA_NEEDED: speed grade / max frequency]
Packaging — Tray
Manufacturer Lead Time — 8 weeks
Logic Family — CMOS

Datasheets & Resources

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