A3PE3000L-FG484 vs A3PE3000L-FG484I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG484 par Microchip Technology et A3PE3000L-FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifMicrochip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG484 | A3PE3000L-FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Low Power Feature | Flash*Freeze technology | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | -40C to +100C (TJ, industrial) |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | ROHS3 Compliant |
| Logic Cells (DFFs) | — | 75264 |
| User I/O (this package) | — | 341 |
| Max User I/O (family) | — | 616 |
| Embedded SRAM | — | 504 kbit true dual-port |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | — | 1.14 V to 1.575 V (1.2 V typical) |
| Single-Chip Solution | — | Yes (no external configuration PROM) |
| Boîtier | — | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Speed | — | [DATA_NEEDED: speed grade / max frequency] |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Logic Family | — | CMOS |