A3PE3000L-FGG896I vs A3PE3000L-1FGG896I Vergleich
Detaillierter Direktvergleich von A3PE3000L-FGG896I von Microchip Technology und A3PE3000L-1FGG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AktivMicrochip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-FGG896I | A3PE3000L-1FGG896I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $139,90 | $0,00 |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 | 3000000 |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Versorgungsspannung | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | Nonvolatile flash, single-chip, Instant On |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Gehäuse / Bauform | 896-BGA (FBGA, 1 mm pitch) | — |
| Montageart | Surface Mount (SMD/SMT) | Surface Mount |
| Betriebstemperatur | Industrial grade (I suffix) | -40C to +85C (industrial, I suffix) |
| Packaging | Tray, standard quantity 27 | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | Standard (no speed suffix) | -1 |
| User I/O | — | 620 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Gehäuse | — | 896-ball FBGA, 1 mm pitch |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | — | 6 |
| Maximum System Performance | — | Approx. 272 MHz |
| Low Power Feature | — | Flash*Freeze Technology |
| Logic Family | — | CMOS |
| Power-Up Support | — | Live at Power-Up Level 0 |