A3PE3000L-FGG896I vs A3PE3000L-1FGG896I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FGG896I par Microchip Technology et A3PE3000L-1FGG896I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActifMicrochip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FGG896I | A3PE3000L-1FGG896I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $139,90 | $0,00 |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 | 3000000 |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Tension d'alimentation | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | Nonvolatile flash, single-chip, Instant On |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Boîtier / Format | 896-BGA (FBGA, 1 mm pitch) | — |
| Type de montage | Surface Mount (SMD/SMT) | Surface Mount |
| Température de fonctionnement | Industrial grade (I suffix) | -40C to +85C (industrial, I suffix) |
| Packaging | Tray, standard quantity 27 | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | Standard (no speed suffix) | -1 |
| User I/O | — | 620 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Boîtier | — | 896-ball FBGA, 1 mm pitch |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | — | 6 |
| Maximum System Performance | — | Approx. 272 MHz |
| Low Power Feature | — | Flash*Freeze Technology |
| Logic Family | — | CMOS |
| Power-Up Support | — | Live at Power-Up Level 0 |