A3PE3000L-FGG896I vs A3PE3000L-1FGG896I Comparación
Comparación detallada lado a lado de A3PE3000L-FGG896I por Microchip Technology y A3PE3000L-1FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoMicrochip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FGG896I | A3PE3000L-1FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $139,90 | $0,00 |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 | 3000000 |
| Total RAM Bits | 516096 bits | — |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) | — |
| Number of I/O | 620 | — |
| Tensión de alimentación | 1.14 V to 1.575 V | — |
| Core Voltage Support | 1.2 V to 1.5 V | — |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based | — |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 | Nonvolatile flash, single-chip, Instant On |
| Special Features | Flash*Freeze technology, single-chip solution | — |
| Encapsulado / Carcasa | 896-BGA (FBGA, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount (SMD/SMT) | Surface Mount |
| Temperatura de funcionamiento | Industrial grade (I suffix) | -40C to +85C (industrial, I suffix) |
| Packaging | Tray, standard quantity 27 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | Standard (no speed suffix) | -1 |
| User I/O | — | 620 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Encapsulado | — | 896-ball FBGA, 1 mm pitch |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | — | 6 |
| Maximum System Performance | — | Approx. 272 MHz |
| Low Power Feature | — | Flash*Freeze Technology |
| Logic Family | — | CMOS |
| Power-Up Support | — | Live at Power-Up Level 0 |