AFS600-2FG484 vs AFS600-2FGG484 Vergleich
Detaillierter Direktvergleich von AFS600-2FG484 von Microchip Technology und AFS600-2FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-2FG484 - 600K-Gate Fusion FPGA | Microchip | 172 I/O
AFS600-2FG484 UnknownMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-2FG484 | AFS600-2FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Unknown | Aktiv |
| Device Type | Fusion mixed-signal FPGA | Fusion mixed-signal field-programmable gate array (FPGA) |
| System Gates | 600,000 gates | 600,000 gates |
| User I/O | 172 I/O | — |
| Gehäuse | 484-pin FBGA | — |
| Technology | 130 nm | — |
| Listed Maximum Frequency | 1470.59 MHz | — |
| Associated Device Parameter | 110592 | — |
| Versorgungsspannung | 1.5 V | 1.5 V |
| Programmable Logic | Flash-based programmable logic | Flash-based programmable logic |
| Analog Resources | Integrated configurable analog resources | — |
| Clock Management | Integrated clock generation and management circuitry | Comprehensive clock generation and management circuitry |
| Memory Support | Embedded memory blocks | — |
| Manufacturer | Microsemi Corporation / Microchip Technology | — |
| Lebenszyklusstatus | [DATA_NEEDED: current manufacturer lifecycle status] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Supported I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Analog Capability | — | Configurable embedded analog blocks |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Betriebstemperatur | — | 0 °C to +85 °C |
| Montageart | — | Surface mount |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |