AFS600-2FG484 vs AFS600-2FGG484 Comparaison
Comparaison détaillée côte à côte de AFS600-2FG484 par Microchip Technology et AFS600-2FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
AFS600-2FG484 - 600K-Gate Fusion FPGA | Microchip | 172 I/O
AFS600-2FG484 UnknownMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ ActifComparaison des spécifications
| Paramètre | AFS600-2FG484 | AFS600-2FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Actif |
| Device Type | Fusion mixed-signal FPGA | Fusion mixed-signal field-programmable gate array (FPGA) |
| System Gates | 600,000 gates | 600,000 gates |
| User I/O | 172 I/O | — |
| Boîtier | 484-pin FBGA | — |
| Technology | 130 nm | — |
| Listed Maximum Frequency | 1470.59 MHz | — |
| Associated Device Parameter | 110592 | — |
| Tension d'alimentation | 1.5 V | 1.5 V |
| Programmable Logic | Flash-based programmable logic | Flash-based programmable logic |
| Analog Resources | Integrated configurable analog resources | — |
| Clock Management | Integrated clock generation and management circuitry | Comprehensive clock generation and management circuitry |
| Memory Support | Embedded memory blocks | — |
| Manufacturer | Microsemi Corporation / Microchip Technology | — |
| Statut du cycle de vie | [DATA_NEEDED: current manufacturer lifecycle status] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Supported I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Analog Capability | — | Configurable embedded analog blocks |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Température de fonctionnement | — | 0 °C to +85 °C |
| Type de montage | — | Surface mount |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |