ATSAMA5D22B-CN vs ATSAMA5D225C-D1M-CU Vergleich
Detaillierter Direktvergleich von ATSAMA5D22B-CN von Microchip Technology und ATSAMA5D225C-D1M-CU von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D22B-CN - Cortex-A5 500MHz MPU 196-TFBGA | Microchip
ATSAMA5D22B-CN ✓ AktivMicrochip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D22B-CN | ATSAMA5D225C-D1M-CU |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,20 | $12,60 |
| Core | ARM Cortex-A5 | — |
| Core Count | 1 | — |
| Datenbusbreite | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| Betriebsversorgungsspannung | [DATA_NEEDED: Vdd_core range] | — |
| I/O Voltage | 3.3 V | — |
| Internal SRAM | 128 KB | — |
| External Memory Interface | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | — |
| Gehäuse | 196-TFBGA (11x11 mm, 0.8 mm pitch) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| Betriebstemperaturbereich | -40C to +85C (industrial) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant | Compliant (Green, lead-free) |
| Backup Mode Current | 5 uA | — |
| Cryptography | AES-256, SHA, secure boot, OTFAES, tamper pins | — |
| Graphics Acceleration | Yes (PTC, LCD controller, overlay) | Yes (LCD controller up to WXGA 1366x768) |
| USB | USB 2.0 + HSIC | 1x HSIC, 1x USB 2.0 HS Host/Device |
| Ethernet | 10/100 Mbps (1) | 10/100/1000 GMAC |
| Series | SAMA5D2 | — |
| Silicon Revision | B | — |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| Betriebstemperatur | — | -40C to +85C (Industrial, IND TEMP) |
| Versorgungsspannung | — | 1.2 V core (per typical SiP) |