ATSAMA5D22C-CU vs ATSAMA5D225C-D1M-CU Vergleich

Detaillierter Direktvergleich von ATSAMA5D22C-CU von Microchip Technology und ATSAMA5D225C-D1M-CU von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAMA5D22C-CU ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip

ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip

ATSAMA5D22C-CU ✓ Aktiv
Microchip Technology
ATSAMA5D225C-D1M-CU ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip

ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip

ATSAMA5D225C-D1M-CU ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAMA5D22C-CU ATSAMA5D225C-D1M-CU
Marke Microchip Technology Microchip Technology
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $7,14 $12,60
Core Architecture ARM Cortex-A5 (32-bit) —
Core Count 1 —
Maximum CPU Clock 500 MHz 500 MHz
NEON Media Engine Yes —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 128 KB —
External Memory Support DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC —
2D Graphics Engine Yes (up to WXGA 1366x768) —
LCD Interface 24-bit, up to 1366x768 —
Ethernet Dual 10/100 Mbps EMAC with 1588 PTP 10/100/1000 GMAC
USB USB HSIC + USB Host/Device 1x HSIC, 1x USB 2.0 HS Host/Device
CAN Dual CAN-FD CAN-FD
Gehäuse 196-TFBGA (CSBGA) 11x11 mm 196-ball TFBGA 11x11 mm, 0.8 mm pitch
Ball Pitch 0.8 mm —
Betriebstemperatur -40C to +85C (industrial) -40C to +85C (Industrial, IND TEMP)
Cryptographic Accelerator AES, SHA, TRNG (hardware) —
Peripheral Touch Controller PTC (embedded) —
Audio Subsystem Embedded (I2S, SSC) —
RoHS-Status Compliant Compliant (Green, lead-free)
Montageart Surface Mount (BGA) Surface Mount (BGA)
Core Processor — ARM Cortex-A5
Number of Cores — 1 Core, 32-Bit
Integrated DRAM — 128 Mbit DDR2 SDRAM (SiP)
ROM / Boot Code — 160 KB ROM
Graphics Acceleration — Yes (LCD controller up to WXGA 1366x768)
RAM Controllers — LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Security — Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG
Touch Controller — Peripheral Touch Controller (PTC) integrated
Audio — Embedded audio subsystem (I2S, Class-D amplifier)
Versorgungsspannung — 1.2 V core (per typical SiP)

Datenblätter & Ressourcen

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