ATSAMA5D26C-CNR vs ATSAMA5D26C-CN Vergleich
Detaillierter Direktvergleich von ATSAMA5D26C-CNR von Microchip Technology und ATSAMA5D26C-CN von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D26C-CNR - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip
ATSAMA5D26C-CNR ✓ AktivMicrochip Technology
ATSAMA5D26C-CN - Cortex-A5 500MHz MPU, 289-LFBGA | Microchip
ATSAMA5D26C-CN ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D26C-CNR | ATSAMA5D26C-CN |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,85 | $6,82 |
| Core Architecture | ARM Cortex-A5 (32-bit) | — |
| Maximum Core Clock | 500 MHz | — |
| Number of Cores | 1 | — |
| Instruction Set | ARMv7-A with Neon and FPU | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Internal SRAM | 128 KB | — |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC | — |
| Hardware Cryptography | AES, SHA, TRNG, secure boot | — |
| Gehäuse | 289-LFBGA (14x14 mm, 0.8 mm pitch) | 289-LFBGA 14x14 mm, 0.8 mm pitch |
| Graphics / LCD | Integrated LCD controller (up to WXGA 1280x720) | — |
| Ethernet | 10/100 Mbps EMAC with GMII/RMII/MII | — |
| USB | USB 2.0 High-Speed Host + Device | — |
| CAN | CAN-FD | — |
| Operating Temperature (Industrial) | -40C to +85C | — |
| Core Supply Voltage | 1.2 V (typ) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Manufacturer | — | Microchip Technology |
| Series | — | SAMA5D2 |
| Core Processor | — | ARM Cortex-A5 |
| Core Count | — | 1 |
| Bit Width | — | 32-bit |
| Maximum CPU Clock | — | 500 MHz |
| On-chip SRAM | — | 128 KB |
| Backup SRAM | — | 32 KB (5 uA retention) |
| FPU | — | Yes (single/double precision) |
| External Memory Bus | — | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 |
| Flash Interfaces | — | 2x QSPI, e.MMC, NAND |
| Hardware Crypto | — | AES, SHA, TRNG, secure boot |
| Embedded Audio Subsystem | — | Yes (I2S, class-D amplifier interface) |
| Betriebstemperatur | — | -40C to +85C (industrial) |
| Versorgungsspannung | — | 1.2 V core (typ) |