BSC9131NJN1HHHB557 vs BSC9131NJN7HHHB Vergleich
Detaillierter Direktvergleich von BSC9131NJN1HHHB557 von NXP Semiconductors und BSC9131NJN7HHHB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BSC9131NJN1HHHB557 | BSC9131NJN7HHHB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | DSP |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Montageart | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | — |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | -40 °C to 105 °C |
| Wärmewiderstand | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge SoC and PowerPC e500 microprocessor |
| CPU Architecture | — | PowerPC e500 |
| CPU Core Count | — | 1 core |
| CPU Data Width | — | 32 bit |
| CPU Frequency | — | 800 MHz |
| DSP Type | — | StarCore DSP |
| DSP Frequency | — | 800 MHz |
| Accelerator | — | MAPLE-B2F |
| Memory Support | — | DDR3 |
| Gehäuse | — | 520-FCBGA |
| Package Dimensions | — | 21 mm x 21 mm |
| Target Application | — | Small-cell base stations and digital baseband processing |
| Additional Target Markets | — | Enterprise VoIP, smart-grid control, military, defense, and industrial |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |