BSC9131NJN1HHHB557 vs BSC9131NJN7HHHB Сравнение
Подробное сравнение бок о бок BSC9131NJN1HHHB557 от NXP Semiconductors и BSC9131NJN7HHHB от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | BSC9131NJN1HHHB557 | BSC9131NJN7HHHB |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | DSP |
| Статус жизненного цикла | Активен | Активен |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Тип монтажа | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | — |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Диапазон рабочих температур | [DATA_NEEDED: operating temperature range] | -40 °C to 105 °C |
| Тепловое сопротивление | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Статус RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Статус жизненного цикла | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge SoC and PowerPC e500 microprocessor |
| CPU Architecture | — | PowerPC e500 |
| CPU Core Count | — | 1 core |
| CPU Data Width | — | 32 bit |
| CPU Frequency | — | 800 MHz |
| DSP Type | — | StarCore DSP |
| DSP Frequency | — | 800 MHz |
| Accelerator | — | MAPLE-B2F |
| Memory Support | — | DDR3 |
| Корпус | — | 520-FCBGA |
| Package Dimensions | — | 21 mm x 21 mm |
| Target Application | — | Small-cell base stations and digital baseband processing |
| Additional Target Markets | — | Enterprise VoIP, smart-grid control, military, defense, and industrial |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |