BSC9131NSN7KHKB vs BSC9131NSN1KHKB557 Vergleich
Detaillierter Direktvergleich von BSC9131NSN7KHKB von NXP Semiconductors und BSC9131NSN1KHKB557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
BSC9131NSN7KHKB ✗ AbgekündigtNXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ AktivSpezifikationsvergleich
| Parameter | BSC9131NSN7KHKB | BSC9131NSN1KHKB557 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Product Type | QorIQ Qonverge network processor SoC | Embedded microprocessor |
| General-Purpose CPU | PowerPC e500, 1 core, 32-bit | — |
| e500 Core Frequency | 800 MHz | — |
| DSP Processor | StarCore SC3850 at 1 GHz | — |
| Specialist Accelerator | MAPLE-B2F | — |
| Schnittstelle | IFC | — |
| External Memory Support | DDR3 | — |
| Gehäuse | 520-FCBGA, 21 x 21 mm | — |
| Pin-Anzahl | 520 balls | — |
| Montageart | Surface Mount | Surface mount |
| Betriebstemperatur | 0 C to 105 C | — |
| Core Count | 1 core | 1 core |
| Word Size | 32-bit | 32-bit |
| Lebenszyklusstatus | End of Life | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Unit Price at Quantity 1 | [DATA_NEEDED: unit price] | — |
| Processor Family | — | QorIQ Qonverge BSC9131 |
| Maximum Operating Frequency | — | 800 MHz |
| Core Technology | — | Power e500 |
| Additional Core Technology | — | StarCore SC3850 |
| DSP Acceleration | — | MAPLE-B2F specialist DSP acceleration processing |
| Package Type | — | 520-FCBGA |
| Package Dimensions | — | 21 x 21 mm |
| Ball Count | — | 520 balls |
| Primary Application | — | Small-cell base stations |
| Additional Applications | — | Enterprise VoIP, smart-grid control, military and defense, industrial |
| Device Category | — | Microprocessor IC, MPU and DSP |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |