BSC9131NSN7KHKB vs BSC9131NSN1KHKB557 Comparação

Comparação detalhada lado a lado de BSC9131NSN7KHKB por NXP Semiconductors e BSC9131NSN1KHKB557 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
BSC9131NSN7KHKB BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors

BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors

BSC9131NSN7KHKB ✗ Fim de vida
NXP Semiconductors
BSC9131NSN1KHKB557 BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 ✓ Ativo

Comparação de especificações

Parâmetro BSC9131NSN7KHKB BSC9131NSN1KHKB557
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Ativo
Product Type QorIQ Qonverge network processor SoC Embedded microprocessor
General-Purpose CPU PowerPC e500, 1 core, 32-bit —
e500 Core Frequency 800 MHz —
DSP Processor StarCore SC3850 at 1 GHz —
Specialist Accelerator MAPLE-B2F —
Interface IFC —
External Memory Support DDR3 —
Encapsulamento 520-FCBGA, 21 x 21 mm —
Contagem de pinos 520 balls —
Tipo de montagem Surface Mount Surface mount
Temperatura de operação 0 C to 105 C —
Core Count 1 core 1 core
Word Size 32-bit 32-bit
Status do ciclo de vida End of Life —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Unit Price at Quantity 1 [DATA_NEEDED: unit price] —
Processor Family — QorIQ Qonverge BSC9131
Maximum Operating Frequency — 800 MHz
Core Technology — Power e500
Additional Core Technology — StarCore SC3850
DSP Acceleration — MAPLE-B2F specialist DSP acceleration processing
Package Type — 520-FCBGA
Package Dimensions — 21 x 21 mm
Ball Count — 520 balls
Primary Application — Small-cell base stations
Additional Applications — Enterprise VoIP, smart-grid control, military and defense, industrial
Device Category — Microprocessor IC, MPU and DSP
AEC-Q100 Status — [DATA_NEEDED: AEC-Q100 qualification status]
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]

Fichas técnicas e recursos

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