BSC9131NXN1KHKB vs BSC9131NSN1KHKB557 Vergleich

Detaillierter Direktvergleich von BSC9131NXN1KHKB von NXP Semiconductors und BSC9131NSN1KHKB557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
BSC9131NXN1KHKB BSC9131NXN1KHKB - 800MHz e500 Processor SoC | NXP | 520-FCBGA

BSC9131NXN1KHKB - 800MHz e500 Processor SoC | NXP | 520-FCBGA

BSC9131NXN1KHKB ✗ Abgekündigt
NXP Semiconductors
BSC9131NSN1KHKB557 BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 ✓ Aktiv

Spezifikationsvergleich

Parameter BSC9131NXN1KHKB BSC9131NSN1KHKB557
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Aktiv
Product Type QorIQ Qonverge communications processor system-on-chip Embedded microprocessor
Processor Core 32-bit PowerPC e500 —
Core Count 1 core 1 core
Processor Frequency 800 MHz —
DSP Technology StarCore SC3850 —
Specialist DSP Accelerator MAPLE-B2F —
Memory Support DDR3 —
Communications Interface IFC —
Bit Width 32-bit —
Gehäuse 520-pin FCBGA —
Package Dimensions 21 mm x 21 mm 21 x 21 mm
Betriebstemperatur -40C to +105C —
Montageart Surface Mount Surface mount
Shipping Package Tray —
Lebenszyklusstatus End of Life —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Processor Family — QorIQ Qonverge BSC9131
Word Size — 32-bit
Maximum Operating Frequency — 800 MHz
Core Technology — Power e500
Additional Core Technology — StarCore SC3850
DSP Acceleration — MAPLE-B2F specialist DSP acceleration processing
Package Type — 520-FCBGA
Ball Count — 520 balls
Primary Application — Small-cell base stations
Additional Applications — Enterprise VoIP, smart-grid control, military and defense, industrial
Device Category — Microprocessor IC, MPU and DSP
AEC-Q100 Status — [DATA_NEEDED: AEC-Q100 qualification status]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]

Datenblätter & Ressourcen

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