BSC9131NXN1KHKB vs BSC9131NSN1KHKB557 مقایسه
مقایسه دقیق کنار به کنار BSC9131NXN1KHKB توسط NXP Semiconductors و BSC9131NSN1KHKB557 توسط NXP Semiconductors. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
NXP Semiconductors
BSC9131NXN1KHKB - 800MHz e500 Processor SoC | NXP | 520-FCBGA
BSC9131NXN1KHKB ✗ پایان تولیدNXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ فعالمقایسه مشخصات
| پارامتر | BSC9131NXN1KHKB | BSC9131NSN1KHKB557 |
|---|---|---|
| برند | NXP Semiconductors | NXP Semiconductors |
| دسته‌بندی | Microcontrollers | Microcontrollers |
| وضعیت چرخه عمر | پایان عمر محصول | فعال |
| Product Type | QorIQ Qonverge communications processor system-on-chip | Embedded microprocessor |
| Processor Core | 32-bit PowerPC e500 | — |
| Core Count | 1 core | 1 core |
| Processor Frequency | 800 MHz | — |
| DSP Technology | StarCore SC3850 | — |
| Specialist DSP Accelerator | MAPLE-B2F | — |
| Memory Support | DDR3 | — |
| Communications Interface | IFC | — |
| Bit Width | 32-bit | — |
| بسته‌بندی | 520-pin FCBGA | — |
| Package Dimensions | 21 mm x 21 mm | 21 x 21 mm |
| دمای کاری | -40C to +105C | — |
| نوع نصب | Surface Mount | Surface mount |
| Shipping Package | Tray | — |
| وضعیت چرخه عمر | End of Life | — |
| وضعیت RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Processor Family | — | QorIQ Qonverge BSC9131 |
| Word Size | — | 32-bit |
| Maximum Operating Frequency | — | 800 MHz |
| Core Technology | — | Power e500 |
| Additional Core Technology | — | StarCore SC3850 |
| DSP Acceleration | — | MAPLE-B2F specialist DSP acceleration processing |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Primary Application | — | Small-cell base stations |
| Additional Applications | — | Enterprise VoIP, smart-grid control, military and defense, industrial |
| Device Category | — | Microprocessor IC, MPU and DSP |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| محدوده دمای کاری | — | [DATA_NEEDED: operating temperature range] |