BSC9131NXN1KHKB vs BSC9131NSN1KHKB557 Comparaison
Comparaison détaillée côte à côte de BSC9131NXN1KHKB par NXP Semiconductors et BSC9131NSN1KHKB557 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
BSC9131NXN1KHKB - 800MHz e500 Processor SoC | NXP | 520-FCBGA
BSC9131NXN1KHKB ✗ Fin de vieNXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ ActifComparaison des spécifications
| Paramètre | BSC9131NXN1KHKB | BSC9131NSN1KHKB557 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Actif |
| Product Type | QorIQ Qonverge communications processor system-on-chip | Embedded microprocessor |
| Processor Core | 32-bit PowerPC e500 | — |
| Core Count | 1 core | 1 core |
| Processor Frequency | 800 MHz | — |
| DSP Technology | StarCore SC3850 | — |
| Specialist DSP Accelerator | MAPLE-B2F | — |
| Memory Support | DDR3 | — |
| Communications Interface | IFC | — |
| Bit Width | 32-bit | — |
| Boîtier | 520-pin FCBGA | — |
| Package Dimensions | 21 mm x 21 mm | 21 x 21 mm |
| Température de fonctionnement | -40C to +105C | — |
| Type de montage | Surface Mount | Surface mount |
| Shipping Package | Tray | — |
| Statut du cycle de vie | End of Life | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Processor Family | — | QorIQ Qonverge BSC9131 |
| Word Size | — | 32-bit |
| Maximum Operating Frequency | — | 800 MHz |
| Core Technology | — | Power e500 |
| Additional Core Technology | — | StarCore SC3850 |
| DSP Acceleration | — | MAPLE-B2F specialist DSP acceleration processing |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Primary Application | — | Small-cell base stations |
| Additional Applications | — | Enterprise VoIP, smart-grid control, military and defense, industrial |
| Device Category | — | Microprocessor IC, MPU and DSP |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Plage de température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |