BSS314PEH6327XTSA1 vs BSS316NH6327XTSA1 Vergleich
Detaillierter Direktvergleich von BSS314PEH6327XTSA1 von Infineon und BSS316NH6327XTSA1 von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BSS314PEH6327XTSA1 | BSS316NH6327XTSA1 |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,15 | $0,13 |
| FET Type | P-Channel | N-Channel, Enhancement Mode |
| Technology | MOSFET (Metal Oxide) | OptiMOS 2 (Trench) |
| Drain-to-Source Voltage (VDS) | -30 V | — |
| Continuous Drain Current (ID) @ TA=25C | -1.5 A | — |
| Power Dissipation (PD) @ TA=25C | 500 mW | — |
| RDS(on) max @ VGS=-10V | 140 mOhm | — |
| RDS(on) max @ VGS=-4.5V | [DATA_NEEDED: RDS(on) at -4.5V VGS] | — |
| Gate Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical value] | — |
| Gate Drive Voltage (max Rds(on)) | -4.5 V, -10 V | — |
| Gehäuse | PG-SOT23-3 (SOT-23-3) | PG-SOT23 (SOT-23-3) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | -55 C to +150 C (TJ) | — |
| Qualification | AEC-Q101 (Automotive) | — |
| Pin Configuration | G-D-S (Gate, Drain, Source) | — |
| MSL-Level | MSL1 (per JEDEC J-STD-020) | MSL1 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant | Compliant |
| Drain-Source Voltage (VDS) | — | 30 V |
| Continuous Drain Current (ID) at TA=25C | — | 1.4 A |
| Pulsed Drain Current (IDM) | — | [DATA_NEEDED: pulsed drain current] |
| Drain-Source On-Resistance RDS(on) max | — | 160 mOhm at VGS=10V, ID=1.4A |
| Gate-Source Threshold Voltage VGS(th) typ | — | 2 V at ID=3.7 uA |
| Total Gate Charge (Qg) | — | 600 pC at VGS=5 V |
| Input Capacitance (Ciss) | — | 94 pF at VDS=15 V |
| Output Capacitance (Coss) | — | [DATA_NEEDED: output capacitance] |
| Reverse Transfer Capacitance (Crss) | — | [DATA_NEEDED: reverse transfer capacitance] |
| Maximum Power Dissipation (PD) at TA=25C | — | 500 mW |
| Betriebs-Sperrschichttemperaturbereich | — | -55 C to +150 C |
| Lead Plating | — | Pb-free (Matte Tin) |
| Automotive Qualification | — | AEC-Q101 qualified |