DSP56303AG100 vs DSP56303VF100 Vergleich

Detaillierter Direktvergleich von DSP56303AG100 von NXP Semiconductors und DSP56303VF100 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
DSP56303AG100 DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors

DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors

DSP56303AG100 ✗ Abgekündigt
NXP Semiconductors
DSP56303VF100 DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 Obsolete

Spezifikationsvergleich

Parameter DSP56303AG100 DSP56303VF100
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP DSP
Lebenszyklusstatus Ende des Lebenszyklus Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $18,90 $30,10
Core Architecture DSP56300 family, 24-bit fixed-point DSP56300 family, 24-bit fixed-point
Instruction Word Width 24-bit —
Data Word Width 24-bit (56-bit accumulator) 24 bits
Operating Frequency 100 MHz (100 MIPS) —
On-Chip Program/Data RAM 24 KB —
On-Chip X/Y Data RAM 24 KB —
Boot ROM 576 bytes —
Core Voltage 1.8 V [DATA_NEEDED: internal core Vdd]
I/O Voltage 3.3 V 3.30 V
Gehäuse 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm 196-ball LBGA (15x15 mm), MAP-BGA-196
External Memory Bus 24-bit address / 24-bit data, 16-bit external data bus expansion —
Serial Interfaces 2x ESSI, 1x SCI, 1x HI08 (Host) —
Timers Triple Timer module (3x 16-bit) —
Address Generation 24-bit ALU with bit-reversed addressing for FFT —
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich -40C to +85C (industrial) —
MSL-Level [DATA_NEEDED: MSL level] [DATA_NEEDED: moisture sensitivity level]
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance per datasheet]
Clock Frequency — 100 MHz
Performance — 100 MIPS (million instructions per second)
Instruction Cycle — Single clock cycle per instruction
Address Space — 24-bit program and data
On-Chip RAM — 24 KB
Bootstrap ROM — 576 bytes
Interfaces — Host Interface (HI08), ESSI, SCI
On-Chip Peripherals — Triple Timer, PLL, External Memory Expansion port
Debug — JTAG/OnCE
Packaging — Tray
Betriebstemperatur — [DATA_NEEDED: industrial temperature grade]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern