DSP56303AG100 vs DSP56303VF100 Comparação
Comparação detalhada lado a lado de DSP56303AG100 por NXP Semiconductors e DSP56303VF100 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
DSP56303AG100 ✗ Fim de vida
Comparação de especificações
| Parâmetro | DSP56303AG100 | DSP56303VF100 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Fim de vida | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $18,90 | $30,10 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | DSP56300 family, 24-bit fixed-point |
| Instruction Word Width | 24-bit | — |
| Data Word Width | 24-bit (56-bit accumulator) | 24 bits |
| Operating Frequency | 100 MHz (100 MIPS) | — |
| On-Chip Program/Data RAM | 24 KB | — |
| On-Chip X/Y Data RAM | 24 KB | — |
| Boot ROM | 576 bytes | — |
| Core Voltage | 1.8 V | [DATA_NEEDED: internal core Vdd] |
| I/O Voltage | 3.3 V | 3.30 V |
| Encapsulamento | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| External Memory Bus | 24-bit address / 24-bit data, 16-bit external data bus expansion | — |
| Serial Interfaces | 2x ESSI, 1x SCI, 1x HI08 (Host) | — |
| Timers | Triple Timer module (3x 16-bit) | — |
| Address Generation | 24-bit ALU with bit-reversed addressing for FFT | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Faixa de temperatura de operação | -40C to +85C (industrial) | — |
| Nível MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Address Space | — | 24-bit program and data |
| On-Chip RAM | — | 24 KB |
| Bootstrap ROM | — | 576 bytes |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |
| Temperatura de operação | — | [DATA_NEEDED: industrial temperature grade] |