DSP56303AG100 vs DSP56303VF100 Comparaison
Comparaison détaillée côte à côte de DSP56303AG100 par NXP Semiconductors et DSP56303VF100 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
DSP56303AG100 ✗ Fin de vie
Comparaison des spécifications
| Paramètre | DSP56303AG100 | DSP56303VF100 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $18,90 | $30,10 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | DSP56300 family, 24-bit fixed-point |
| Instruction Word Width | 24-bit | — |
| Data Word Width | 24-bit (56-bit accumulator) | 24 bits |
| Operating Frequency | 100 MHz (100 MIPS) | — |
| On-Chip Program/Data RAM | 24 KB | — |
| On-Chip X/Y Data RAM | 24 KB | — |
| Boot ROM | 576 bytes | — |
| Core Voltage | 1.8 V | [DATA_NEEDED: internal core Vdd] |
| I/O Voltage | 3.3 V | 3.30 V |
| Boîtier | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| External Memory Bus | 24-bit address / 24-bit data, 16-bit external data bus expansion | — |
| Serial Interfaces | 2x ESSI, 1x SCI, 1x HI08 (Host) | — |
| Timers | Triple Timer module (3x 16-bit) | — |
| Address Generation | 24-bit ALU with bit-reversed addressing for FFT | — |
| Type de montage | Surface Mount | Surface Mount |
| Plage de température de fonctionnement | -40C to +85C (industrial) | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Address Space | — | 24-bit program and data |
| On-Chip RAM | — | 24 KB |
| Bootstrap ROM | — | 576 bytes |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |
| Température de fonctionnement | — | [DATA_NEEDED: industrial temperature grade] |