DSP56321VF200 vs DSP56311VF150 Vergleich
Detaillierter Direktvergleich von DSP56321VF200 von NXP Semiconductors und DSP56311VF150 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DSP56321VF200 | DSP56311VF150 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $62,00 | $24,90 |
| Part Number | DSP56321VF200 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Product Type | Fixed-Point Digital Signal Processor (DSP) | — |
| DSP Family | DSP56300 family, DSP56000 code-compatible | — |
| Core Architecture | 24-bit fixed-point, single-cycle engine | — |
| Clock Speed | 200 MHz | — |
| On-Chip RAM | 576 KB | 384 KB |
| Bootstrap ROM | 576 bytes | 576 B |
| Instruction Cache | Yes | — |
| Coprocessor | Enhanced Filter Coprocessor (EFCOP) | — |
| DMA Channels | 6 channels | 6 |
| Addressing | 24-bit address space, barrel shifter | — |
| Interfaces | Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Gehäuse | 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) | 196-ball MAP-BGA (15x15 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Betriebs-Sperrschichttemperatur | -40C to +100C (TJ) | — |
| Packaging | Tray | — |
| Series | — | DSP56300 (Symphony) |
| Type | — | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Datenbusbreite | — | 24 bit |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| Input Logic Compatibility | — | TTL-compatible |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Process Technology | — | High-density CMOS |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |