DSP56321VF200 vs DSP56311VF150 Comparaison
Comparaison détaillée côte à côte de DSP56321VF200 par NXP Semiconductors et DSP56311VF150 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | DSP56321VF200 | DSP56311VF150 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $62,00 | $24,90 |
| Part Number | DSP56321VF200 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Product Type | Fixed-Point Digital Signal Processor (DSP) | — |
| DSP Family | DSP56300 family, DSP56000 code-compatible | — |
| Core Architecture | 24-bit fixed-point, single-cycle engine | — |
| Clock Speed | 200 MHz | — |
| On-Chip RAM | 576 KB | 384 KB |
| Bootstrap ROM | 576 bytes | 576 B |
| Instruction Cache | Yes | — |
| Coprocessor | Enhanced Filter Coprocessor (EFCOP) | — |
| DMA Channels | 6 channels | 6 |
| Addressing | 24-bit address space, barrel shifter | — |
| Interfaces | Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Boîtier | 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) | 196-ball MAP-BGA (15x15 mm) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Température de jonction en fonctionnement | -40C to +100C (TJ) | — |
| Packaging | Tray | — |
| Series | — | DSP56300 (Symphony) |
| Type | — | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Largeur du bus de données | — | 24 bit |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| Input Logic Compatibility | — | TTL-compatible |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Process Technology | — | High-density CMOS |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |