DSP56321VF200 vs DSP56311VF150 Comparación
Comparación detallada lado a lado de DSP56321VF200 por NXP Semiconductors y DSP56311VF150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | DSP56321VF200 | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $62,00 | $24,90 |
| Part Number | DSP56321VF200 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Product Type | Fixed-Point Digital Signal Processor (DSP) | — |
| DSP Family | DSP56300 family, DSP56000 code-compatible | — |
| Core Architecture | 24-bit fixed-point, single-cycle engine | — |
| Clock Speed | 200 MHz | — |
| On-Chip RAM | 576 KB | 384 KB |
| Bootstrap ROM | 576 bytes | 576 B |
| Instruction Cache | Yes | — |
| Coprocessor | Enhanced Filter Coprocessor (EFCOP) | — |
| DMA Channels | 6 channels | 6 |
| Addressing | 24-bit address space, barrel shifter | — |
| Interfaces | Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Encapsulado | 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) | 196-ball MAP-BGA (15x15 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Temperatura de unión de funcionamiento | -40C to +100C (TJ) | — |
| Packaging | Tray | — |
| Series | — | DSP56300 (Symphony) |
| Type | — | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Ancho del bus de datos | — | 24 bit |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| Input Logic Compatibility | — | TTL-compatible |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Process Technology | — | High-density CMOS |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |