EP1AGX50CF484I6 vs EP1AGX35CF484I6 Vergleich
Detaillierter Direktvergleich von EP1AGX50CF484I6 von Intel und EP1AGX35CF484I6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1AGX50CF484I6 | EP1AGX35CF484I6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $275,00 | $198,50 |
| Family | Arria GX | Arria GX |
| Logic Elements (LEs) | 50160 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 484-ball FBGA (FC-FBGA), 1.0 mm pitch | 484-ball FC-FBGA |
| Package Code | S-PBGA-B484 | — |
| Maximum User I/O | 229 | — |
| Number of Terminals | 484 | — |
| Package Shape | Square | — |
| Embedded Memory | 2475072 bits | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Count | Up to 12 (3.125 Gbps) | — |
| Speed Grade | I6 (industrial) | — |
| Betriebstemperaturbereich | -40C to +100C (industrial) | — |
| Configuration Scheme | Passive serial, passive parallel, JTAG | — |
| PLL Count | Up to 8 | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS Status] |
| MSL-Level | 3 | [DATA_NEEDED: MSL Level] |
| Montageart | Surface Mount | Surface Mount |
| Body Material | Plastic / Epoxy | — |
| Logic Elements | — | 33,520 |
| Logic Array Blocks (LABs) | — | 1,676 |
| Embedded Memory Bits | — | 1,348,416 |
| Maximum User I/Os | — | 230 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps) |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Configuration Method | — | SRAM + JTAG/External PROM |
| Lead-Free | — | [DATA_NEEDED: Lead-Free Status] |