EP1AGX50CF484I6 vs EP1AGX35CF484I6 Comparación
Comparación detallada lado a lado de EP1AGX50CF484I6 por Intel y EP1AGX35CF484I6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1AGX50CF484I6 | EP1AGX35CF484I6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $275,00 | $198,50 |
| Family | Arria GX | Arria GX |
| Logic Elements (LEs) | 50160 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Encapsulado | 484-ball FBGA (FC-FBGA), 1.0 mm pitch | 484-ball FC-FBGA |
| Package Code | S-PBGA-B484 | — |
| Maximum User I/O | 229 | — |
| Number of Terminals | 484 | — |
| Package Shape | Square | — |
| Embedded Memory | 2475072 bits | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Count | Up to 12 (3.125 Gbps) | — |
| Speed Grade | I6 (industrial) | — |
| Rango de temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Configuration Scheme | Passive serial, passive parallel, JTAG | — |
| PLL Count | Up to 8 | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS Status] |
| Nivel MSL | 3 | [DATA_NEEDED: MSL Level] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Body Material | Plastic / Epoxy | — |
| Logic Elements | — | 33,520 |
| Logic Array Blocks (LABs) | — | 1,676 |
| Embedded Memory Bits | — | 1,348,416 |
| Maximum User I/Os | — | 230 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps) |
| Ball Pitch | — | 1.0 mm |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Configuration Method | — | SRAM + JTAG/External PROM |
| Lead-Free | — | [DATA_NEEDED: Lead-Free Status] |