EP1C12F324C8L vs EP1C12F324C7 Vergleich
Detaillierter Direktvergleich von EP1C12F324C8L von Intel und EP1C12F324C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F324C8L | EP1C12F324C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,40 | $40,26 |
| Family | Cyclone | Cyclone |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Gehäuse | FBGA-324 | 324-ball FineLine BGA (FBGA-324) |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | CMOS, 130 nm | 130 nm CMOS |
| Betriebstemperatur | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Power Variant | Low-power (L suffix) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Core Voltage | — | 1.5 V |
| Operating Frequency (max) | — | 320.1 MHz |
| Number of PLLs | — | 2 |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |