EP1C12F324C8L vs EP1C12F324C7 Comparación
Comparación detallada lado a lado de EP1C12F324C8L por Intel y EP1C12F324C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C12F324C8L | EP1C12F324C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $23,40 | $40,26 |
| Family | Cyclone | Cyclone |
| Logic Elements | 12,060 | — |
| Embedded RAM Bits | 239,616 | — |
| M4K RAM Blocks | 52 | — |
| User I/O Pins | 249 | — |
| PLLs | 2 | — |
| Encapsulado | FBGA-324 | 324-ball FineLine BGA (FBGA-324) |
| Package Body Size | 19 x 19 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | CMOS, 130 nm | 130 nm CMOS |
| Temperatura de funcionamiento | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Power Variant | Low-power (L suffix) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Core Voltage | — | 1.5 V |
| Operating Frequency (max) | — | 320.1 MHz |
| Number of PLLs | — | 2 |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |