EP1M120F484C6N vs EP1M120F484C6 Vergleich
Detaillierter Direktvergleich von EP1M120F484C6N von Intel und EP1M120F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M120F484C6N | EP1M120F484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,50 | $198,00 |
| Family | Mercury (APEX PLD platform) | Mercury (APEX EP1M) |
| Typical Gates | 120,000 | 120,000 |
| Logic Cells / Elements | 4,800 | — |
| Logic Array Blocks (LABs) | 480 | 480 |
| User I/Os | 303 | — |
| Gehäuse | 484-ball FC-FBGA (FineLine BGA) | 484-ball FC-FBGA (FineLine BGA) |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Transceiver Data Rate | Up to 1.25 Gbps with CDR | — |
| Betriebstemperatur | 0C to 85C (commercial) | 0 C to +85 C (Commercial) |
| Process Technology | CMOS | [DATA_NEEDED: process node] |
| Architecture | LUT-based, optimized for high-speed interconnect | — |
| MultiCore Support | Yes (hot socketing) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Cells | — | 4,800 |
| Logic Elements (LEs) | — | 49,152 (per distributor listing) |
| User I/O | — | 303 |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Core Supply Voltage | — | 1.8 V |
| Logic Family | — | CMOS |
| Integrated Transceivers | — | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM / ROM / CAM) |