EP1M120F484C6N vs EP1M120F484C6 Comparación
Comparación detallada lado a lado de EP1M120F484C6N por Intel y EP1M120F484C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1M120F484C6N | EP1M120F484C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $56,50 | $198,00 |
| Family | Mercury (APEX PLD platform) | Mercury (APEX EP1M) |
| Typical Gates | 120,000 | 120,000 |
| Logic Cells / Elements | 4,800 | — |
| Logic Array Blocks (LABs) | 480 | 480 |
| User I/Os | 303 | — |
| Encapsulado | 484-ball FC-FBGA (FineLine BGA) | 484-ball FC-FBGA (FineLine BGA) |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Transceiver Data Rate | Up to 1.25 Gbps with CDR | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | 0 C to +85 C (Commercial) |
| Process Technology | CMOS | [DATA_NEEDED: process node] |
| Architecture | LUT-based, optimized for high-speed interconnect | — |
| MultiCore Support | Yes (hot socketing) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Cells | — | 4,800 |
| Logic Elements (LEs) | — | 49,152 (per distributor listing) |
| User I/O | — | 303 |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Core Supply Voltage | — | 1.8 V |
| Logic Family | — | CMOS |
| Integrated Transceivers | — | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM / ROM / CAM) |