EP1M120F484C6N vs EP1M120F484C6 Comparaison
Comparaison détaillée côte à côte de EP1M120F484C6N par Intel et EP1M120F484C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1M120F484C6N | EP1M120F484C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $56,50 | $198,00 |
| Family | Mercury (APEX PLD platform) | Mercury (APEX EP1M) |
| Typical Gates | 120,000 | 120,000 |
| Logic Cells / Elements | 4,800 | — |
| Logic Array Blocks (LABs) | 480 | 480 |
| User I/Os | 303 | — |
| Boîtier | 484-ball FC-FBGA (FineLine BGA) | 484-ball FC-FBGA (FineLine BGA) |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Transceiver Data Rate | Up to 1.25 Gbps with CDR | — |
| Température de fonctionnement | 0C to 85C (commercial) | 0 C to +85 C (Commercial) |
| Process Technology | CMOS | [DATA_NEEDED: process node] |
| Architecture | LUT-based, optimized for high-speed interconnect | — |
| MultiCore Support | Yes (hot socketing) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Cells | — | 4,800 |
| Logic Elements (LEs) | — | 49,152 (per distributor listing) |
| User I/O | — | 303 |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Core Supply Voltage | — | 1.8 V |
| Logic Family | — | CMOS |
| Integrated Transceivers | — | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM / ROM / CAM) |