EP1M350F780I6AA vs EP1M350F780I7 Vergleich
Detaillierter Direktvergleich von EP1M350F780I6AA von Intel und EP1M350F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1M350F780I7 - Mercury PLD 350K Gates FPGA | Altera (Intel)
EP1M350F780I7 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1M350F780I6AA | EP1M350F780I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $165,20 |
| Family | Mercury | Mercury PLD |
| Device Logic Elements / Cells | 14,400 | — |
| Number of Gates | 350K system gates | — |
| Betriebsversorgungsspannung | 1.8 V core | — |
| User I/O Count | 486 | — |
| Gehäuse | 780-Ball FC-FBGA | 780-pin FineLine BGA (F780) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | 6 (slowest) | I7 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Assembly | Yes (AA suffix) | — |
| Embedded Transceivers | Yes (high-speed differential with CDR support) | — |
| Configuration Method | Serial / Parallel via EPC configuration device | — |
| Process Technology | 0.13 µm CMOS | 0.15 µm CMOS |
| Supplier Device Package | 780-FBGA | — |
| System Gates | — | 350,000 |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| High-Speed Serial Channels | — | 18 (up to 8 channels at 1.25 Gbps) |
| Maximum Serial Data Rate | — | 1.25 Gbps |
| Configuration Memory | — | SRAM-based (requires external configuration device) |
| Betriebstemperatur | — | -40 °C to +100 °C (Industrial) |
| MSL-Level | — | 3 (168 hours) |