EP1M350F780I6AA vs EP1M350F780I7 Comparación
Comparación detallada lado a lado de EP1M350F780I6AA por Intel y EP1M350F780I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1M350F780I6AA | EP1M350F780I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $165,20 |
| Family | Mercury | Mercury PLD |
| Device Logic Elements / Cells | 14,400 | — |
| Number of Gates | 350K system gates | — |
| Tensión de alimentación de funcionamiento | 1.8 V core | — |
| User I/O Count | 486 | — |
| Encapsulado | 780-Ball FC-FBGA | 780-pin FineLine BGA (F780) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | 6 (slowest) | I7 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Assembly | Yes (AA suffix) | — |
| Embedded Transceivers | Yes (high-speed differential with CDR support) | — |
| Configuration Method | Serial / Parallel via EPC configuration device | — |
| Process Technology | 0.13 µm CMOS | 0.15 µm CMOS |
| Supplier Device Package | 780-FBGA | — |
| System Gates | — | 350,000 |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| High-Speed Serial Channels | — | 18 (up to 8 channels at 1.25 Gbps) |
| Maximum Serial Data Rate | — | 1.25 Gbps |
| Configuration Memory | — | SRAM-based (requires external configuration device) |
| Temperatura de funcionamiento | — | -40 °C to +100 °C (Industrial) |
| Nivel MSL | — | 3 (168 hours) |