EP1S25F672C8N vs EP1S25F672C5N Vergleich

Detaillierter Direktvergleich von EP1S25F672C8N von Intel und EP1S25F672C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1S25F672C8N EP1S25F672C5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $179,40 $142,00
Family Stratix (EP1S) Stratix
Logic Elements (LE) 25,660 —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V 1.5 V (nominal)
Embedded Memory 1,944 Kbit (TriMatrix) —
DSP Blocks 12 (9-bit x 9-bit multipliers) —
PLLs 6 —
Maximum User I/O 426 —
Betriebstemperatur 0 °C to 85 °C (commercial) —
Speed Grade C8 (-8) C5
Package Type 672-ball FineLine BGA (FBGA) FineLine BGA (FBGA)
Package Dimensions 35 x 35 mm, 1.27 mm pitch —
Logic Family CMOS —
Maximum Internal Frequency 357.14 MHz 500 MHz
Configuration Passive Serial / Passive Parallel / JTAG / EPC device —
RoHS-Status Compliant (lead-free N suffix) Compliant
Origin Altera (acquired by Intel, 2015) —
Series — EP1S25
Logic Elements (Cells) — 25,660
Number of CLBs — 2,566
Number of Logic Cells / Gates — [DATA_NEEDED: total system gates]
Number of I/O Pins — 473 user I/O
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Package Pin Count — 672
Ball Pitch — 1.00 mm
Betriebstemperaturbereich — 0 °C to +85 °C (commercial)
Lead-Free (Pb-Free) — Yes (suffix "N")
Configuration Method — SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel
Montageart — Surface Mount (BGA)

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